Package Development Engineer

조회수: 3847, 2009.10.29 17:40:50
  • 게시글 주소 : http://kimcom.co.kr/2296
sunyoung

JOB TITLE

    

    Package Development Engineer    

 

   

 

JOB DESCRIPTION

      -. New Package development for discrete, SPM and APM

-. Material modification & Package modification for Derivative 
    package development

-. New Intelligent Properties generation

-. Survey and Study for New package technology and trend

REQUIRED KNOWLEDGE & SKILL

    

                '-. BS or MS in Material Science engineering / Metallurgy / 
                    Mechanical engineering
                
                  -. Over 4 years experience of Packaging engineering in
                     semiconductor industry 
                 
                  -. Preferential treatment for Power module development
                      experience
                 
                  -. Key meterial (EMC & leadframe) experience
                 
                  -. Assembly process experience
                 
                  -. Communication skills in English


            -. Willingness to travel occasionally (mostly within Korea, but also to some
               degree to China and USA)

ADDITIONAL INFO


         •               Position Level : 대리급
   •               Status: Permanent

         •               Salary: Nego

         •               위치: 경기도   

         •               제출서류: 영문 이력서 & 영문자기소개서 (MS-word file)

CONTACT POINT

  

        •               담당자 - 김의태

        •               Email daniel@kimcom.co.kr

        •               Tel 02) 574-2490 / 02) 574-2479

        •               주소 : 서울 강남구 논현동 241-3 SK허브블루 1305호 

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