Job Title

     Packaging Engineer

Requirements

  • BS in Mechanical / Electrical / Industrial Engineering or related field.
  • 5-8 years of engineering / manufacturing experience in semiconductor packaging technology.
  • Individual will work with Marketing and Device Engineering groups to bring new packaging designs to the market.
  • Excellent presentation skills.
  • Knowledge of SPC techniques.
  • DOE experiments.
  • AutoCad, Lotus Notes, Microsoft Power Point, Word and Excel.  
  • International travel will be required.  
  • Thorough understanding of semiconductor assembly materials a must.
  • Good command in English and Korean is a must.

Responsibilities

  • This position is for an engineering professional with experience in the semiconductor industry especially Asia subcontractors.
  • Basic areas of knowledge include laminate and/or ceramic substrates, lead-frames, surface mount, die attach, wire bond, mold and singulation processes.
  • Will interface as liaison between external suppliers and Engineering, Test, SCM, and Quality departments.
  • In addition to engineering issues, he / she will be accountable for on-time delivery of designs, material and assembly documentation as well as schedules for qualifications.

Additional Info.

  • Status: Permanent
  • Salary: Nego
  • 위치: 서울
  • 제출서류: 영문 이력서 & 영문자기소개서 (MS-word file)

Contact point

☞ Email cindy@kimcom.co.kr Tel 02) 6241-2479
서울 강남구 도곡동 467-10 우성리빙텔 602호
(약도보기)

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